BGA Reballing Middle Layer Stencil Compatible For Samsung Galaxy S21 Ultra (SM-G998)
$4.1
Product Details
The **BGA Reballing Middle Layer Stencil** compatible with the Samsung Galaxy S21 Ultra (SM-G998) is a precision tool used in the reballing process of Ball Grid Array (BGA) components on the device’s motherboard. This stencil helps to accurately position and solder the balls on the BGA chips, ensuring a reliable and stable connection between the chip and the PCB. Ideal for advanced repair technicians and refurbishers, it facilitates precise reballing and helps maintain the integrity and performance of your Galaxy S21 Ultra’s internal components. Perfect for professional repairs and high-quality motherboard servicing.